NEC to exhibit M2M service enabled by mobile cloud and mobile broadband solutions at Mobile World Congress 2012
NEC Corporation (NEC) announced that it will attend the Mobile World Congress 2012 at the Fira de Barcelona, Barcelona February 27 – March 1 2012 more
INSIDE Secure surpasses ten million unit milestone for NFC chip shipments
NFC market achieves liftoff in year one of commercial NFC deploymentmore
Broadcom launches digital broadcast conversion technology for global markets
Broadcom Corporation, a global innovation leader in semiconductor solutions for wired and wireless communications, announced its 40nm HD Cross-Platform Global Digital TV Transport Adapter (DTA) system-on-a-chip (SoC) product family
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STMicroelectronics boosts next-generation basestations as mobile broadband booms
Combined down-converter and synthesizer IC leverages ST process advantage to deliver cost-saving integration with optimum performance and flexibility more
Sygic exhibits its 3D GPS navigation at China Sourcing Fair in Hong Kong
Sygic is exhibiting its 3D GPS navigation software for personal navigation devices (PND) and InDash devices at the China Sourcing Fair in Hong Kong – Asia World Expo from April 12-15, 2011 in booth no. 1K09, Hall 1
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Sony Computer Entertainment announce its next generation portable entertainment system
Ultimate portable entertainment system makes its debut this year, further expanding the PlayStation® Business in the portable gaming market more
RFMD® expands broadband product portfolio for hybrid fiber coax (HFC) networks
New products include amplifiers and wide bandwidth passive components more
Agilent Technologies announces handheld spectrum analyser
Makes infield measurements easier, faster, more precise more
Agilent introduces wide-bandwidth oscilloscope for faster, more accurate characterisation of high-speed digital designs
Agilent Technologies Inc. recently expanded its digital communications analyser (DCA) portfolio with the introduction of the 86100D DCA-X wide-bandwidth oscilloscope. The DCA-X provides engineers with the tools needed to characterise their high-speed digital designs easily and accurately
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Telegent ships 80 million mobile TV chips globally
Company launches CEO search in preparation for next phase of growthmore