Copia de LIS302DLH_p2388sHigh.jpg

World’s thinnest MEMS accelerometer from STMicroelectronics drives movement-activated features into ultra-slim designs

Low-profile high-stability motion-sensing IC allows mobile applications to deliver enhanced user experiences


ST-Ericsson reports financial results for its first two months of operation

50/50 joint venture between Ericsson and STMicroelectronics started operations on February 2nd 2009, creating a new wireless-semiconductor industry leader

Copia de IMGP4168.JPG

NEC is present at Mobile World Congress 2009

NEC is a major player in all areas of the event, with a high profile presence at the conference and on the exhibition floor

Copia de photo5.jpg

Ericsson and STMicroelectronics complete deal to create world leader in semiconductors and platforms for mobile applications

STMicroelectronics and Ericsson announced the closing of their agreement merging Ericsson Mobile Platforms and ST-NXP Wireless into a 50/50 joint venture